The P82-GBE is equipped with an M.2 style PCIe^® x4 socket, suitable for a NVMe^® or SATA type SSD module, for installation of the operating system and also for data storage.

The Ethernet backplane ports can be used either for a hybrid backplane as CompactPCI^® Serial system expansion, or with a J2 rear I/O module.

• Proprietary size mezzanine module for PC7-FESTIVAL CPU card
• Fits basically into the 4HP (20.32mm) envelope of the CPU carrier board
• Typically delivered as a ready to use assembly unit (including CPU card)
• Mounting position right (on top of a CPU board)

• PC7-FESTIVAL (2022 version) as of current

• High speed mezzanine connectors
• Suitable for PCI Express^® Gen3
• Bottom mount connectors HSE1, HSE2 (high speed expansion) and GBE (Ethernet)
• Mating with the carrier card connectors HSE1/2 and GBE
• Board-to-board height 10.0mm for a 4HP assembly

  HSE1

• PCI Express^® x4 support from CPU card to P82 (dedicated to the NVMe SSD module M.2 socket

  HSE2

• PCI Express^® 4x1 support from CPU Card to P82 (dedicated to the on-board Gigabit Ethernet controllers, two of 4 PCIe^® links in use)

  GBE

• Dual Gigabit Ethernet support from P82 to the CPU Card (wired there to the J2 backplane connector according to the CompactPCI^® PlusIO specification pin assignment)

• Single M.2 (formerly known as NGFF) socket, maximum M.2 size 2280
• Suitable for an M.2 NVMe SSD module, key Id M, PCIe x4 I/F
• PCIe x4 sourced via HSE1 mezzanine connector (option SATA)
• Maximum (theoretical) 32Gbps I/O data transfer rate (Gen3 PCIe 8GT/s)
• M.2 SATA SSD option (auto detect, only available with PC7-FESTIVAL CPU carrier card)
• Module dimensions 2230/2242/2260/2280, screw fixed
• Module height (Label) S1-S5 D1-D4
• Power switch, undervoltage lockout, short-circuit protection, quick discharge

• Two individual Intel^® I225/226-IT networking interface controllers (NIC)
• 2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T 802.3 specifications
• -40°C to +85°C operating temperature 10M/100M/1G
• -40°C to +70°C operating temperature 2.5G (I225)
• -40°C to +85°C operating temperature 2.5G (I226)
• UDP, TCP and IP checksum offload
• 9KB Jumbo Frame support
• Four transmit and four receive queues
• IEEE 802.3az Energy Efficient Ethernet
• Ultra-low power at cable disconnect (5mW)
• Time Sensitive Networking (TSN)
• IEEE 1588 - Basic time-sync (Precision Time Protocol)
• IEEE 802.1AS-Rev - Higher precision time synchronization with multiple (dual) clock masters
• IEEE 802.1Qav - Credit Based Shaping and Basic scheduling
• IEEE 802.1Qbu - Frame Preemption
• IEEE 802.1Qbv - Time Aware Shaper
• IEEE 802.3br - Interspersing Express Traffic
• PCIe^® PTM for synchronization between the NIC and Host timers

• Low profile mezzanine module for EKF CPU Card PC7-FESTIVAL
• 4HP assembly CPU carrier board and P82-GBE mezzanine card
• Adds SSD mass storage and backplane Ethernet networking to the CPU carrier
• M.2 based mass storage, 1 x M.2 PCIe x4 socket (NVMe) or SATA
• On-board GbE NICs for backplane communication (CompactPCI^® Serial slots) or passive RIO module

• Designed & manufactured in Germany
• ISO 9001 certified quality management
• Long term availability
• Rugged solution
• Coating, sealing, underfilling on request
• Lifetime application support
• RoHS compliant
• Operating temperature -40°C to +85°C industrial temperature range
• Storage temperature -40°C to +85°C, max. gradient 5°C/min
• Humidity 5% ... 95% RH non condensing
• Altitude -300m ... +3000m
• Shock 15g 0.33ms, 6g 6ms
• Vibration 1g 5-2000Hz
• EC Regulatory EN55024, EN55032, EN62368-1
• MTBF tbd years (MIL-HDBK-217F, SN29500 @+40°C)